- Interconnects Connectors Board To Board connectors
Description
Specification
- Insulator Material: High Temp. Thermoplastic, UL94V-0.
- Contact Material: Phosphor Bronze.
- Board Lock Material: Brass.
- Contact Plating: Au on Contact Area. Sn (100u" Min.) on Soldertail. Nickle (Contact - 80u" Min. /Soldertail - 50u" Min.)
- Board Lock Plating: Sn(100u" Min.) over Nickel (40u" Min.)
- Current Resistance: 1.2A Max.
- Contact Resistance: 25 Milliohms Max.
- Insulator Resistance: 1000 Megohms Min.
- Dielectric Withstanding: 500V AC for 1 Minute.
- Operating Temperature: -55°C ~ +125°C.
- Max. Processing Temp.: 230°C for 30-60 seconds. 260°C for 10 seconds.
Supplier Information
Unicorn Electronics Components Co., Ltd.
TEL : 886-2-22984558 FAX : 886-2-229845598FL., NO.8, LANE 7, WU-CHUAN RD., WU-KU DIST., NEW TAIPEI CITY 248, TAIWAN, R.O.C.
Web-Site : http://www.une.com.tw/
E-Mail : unicorn@une.com.tw